Honor will hold a new launch event on July 2nd during which the long awaited will be announced Honor X10 Max 5G. While waiting for the official, the specifications and some renderings related to the smartphone have been leaked on the net.
A few days ago the Honor X10 Max 5G, identified by the model number KKG-AN00 was identified on the TENAA certification site while in the last hours also peeked out on Geekbench, confirming most of the technical characteristics.
The list appeared on Geekbench highlighted as the next device of the Chinese house will be powered by the new SoC Soc Dimensity 800 5G produced by Mediatek and on board will find space 8 GB of RAM with Android 10 and customized interface MagicUI 3.1.
Moving on to the score recorded on Geekbench, the device reached 539 points in single-core tests while it reached 2186 points in the multi-core test.
The TENAA list allowed us to know most of the device’s specifications in advance. The smartphone would indeed have a 7.09-inch LCD display with FHD + resolution (1080 x 2280) and a drop notch placed centrally on the front panel. New information has also emerged regarding RAM which in the basic model could be 6 GB instead of 8 while the storage variants could be 64 GB and 128 GB further expandable via microSD card.
The device would then show up a fingerprint scanner placed on the side. Another very interesting aspect will be that related to the battery, according to what emerged in fact, we could find a 5000 mAh unit with support for fast charging 22.5 W via USB-C.
The premises are all there, now, you just have to wait for the official announcement.
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