Realme X9 Series Supported by Snapdragon 778 and 870

Jakarta, Selular.ID – In January, Madhav Sheth, CEO of Realme shared a picture of the new Realme phone along with a stack of credit cards, to highlight its slim profile. Like the leaked images at the time, this phone featured a colorful back with the “Realme” and “Dare to Leap” brands.

The bottom edge of the Realme X9 has a loudspeaker grille, USB-C port, and microphone. But There is no 3.5mm audio jack on the bottom edge of the phone. It’s unclear if a headphone slot is available on the top edge of the phone.

And the latest leak claims that the launch of the Realme X9 series is getting closer. The device is predicted to be powered by the Snapdragon 778 and Snapdragon 870 chipsets for each of the Realme X9 and Realme X9 Pro variants.

As quoted by Gadget Now, a leaker with an identity on Weibo as “Small Town Repair Machine” revealed a device with model number RMX3366 which is believed to be the Realme X9 Pro has appeared on the Chinese certification site Tenaa. According to another leak called Digital Chat Station, the Realme X9 comes with a 6.5-inch OLED screen with Full HD + resolution.

BacaJuga:Realme X9 Design Leaks Revealed, Looks Sleek

The listing on Tenaa also mentions that this new Realme smartphone has a 2,200mAh battery which is likely a dual battery setup with a total capacity of 4,400mAh or 4,500mAh.

The device will carry 5G connectivity and run the Android 11 operating system and the MediaTek Dimensity 1200 chipset. The leaker predicts that the price of the Realme X9 can start at 2,000 yuan or Rp. 4.5 million while the Realme X9 Pro reaches 2,500 yuan or Rp. 5.7 million.

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