Mediatek Launches Dimensity 7200 Ultra: Specs and Features

KOMPAS.com – Mediatek officially launched its newest upper middle class (premium) mobile chipset, dubbed the Dimensity 7200 Ultra.

As the name suggests, this System-on-Chip (SoC) is the “brother” of the Dimensity 7200 which was launched last February.

So, by adding the label “Ultra”, Mediatek claims that this newest SoC has improvements in terms of performance and power efficiency.

However, on paper, the specifications of the Dimensity 7200 and 7200 Ultra chipsets can be said to be identical.

Also read: MediaTek Makes a 3 Nm Dimensity Chip like the iPhone 15

These two chipsets are made with 4 nanometer (nm) fabrication technology from Taiwam Semiconductor Manufacturing Company (TSMC).

Inside the Dimensity 7200 Ultra SoC, there are eight core (octa core) processors (CPU). The eight CPU cores consist of two Cortex-A715 cores (2.8 GHz) and six Cortex-A510 cores (2.0 GHz).

For visual processing, the Dimensity 7200 Ultra SoC is supported by an ARM Mali G610 graphics processing unit (GPU), as well as LPDDR4x and LPDDR5 RAM support.

This SoC is also equipped with a Mediatek APU 650 chip to boost artificial intelligence (AI) performance, as well as an Imagiq 765 image processing (ISP) chip to improve image quality. This ISP supports 14-bit HDR image format.

Regarding the photography aspect, the Mediatek Dimensity 7200 Ultra supports a main camera of up to 200 megapixels (MP) which supports 4K video recording with a frame rate of 30 FPS.

For display matters, the Dimensity 7200 Ultra chipset supports screen resolutions up to Full HD Plus resolution with a refresh rate of up to 144 Hz.

Also read: Mobile Phone Chip Market Review: MediaTek Dominates 4G, Qualcomm 5G

Other supporting features that equip the Dimensity 7200 Ultra chipset include support for 5G connectivity (dual standby), Voice over New Radio (VoNR), and HyperEngine 5.0 which is claimed to improve cellphone performance when playing games.

Mediatek has not announced when this chipset will be mass produced. They also did not provide information on what cellphones would be powered by this chipset for the first time.

However, Xiaomi, in a post on their official Weibo account, said that one of its newest mid-range cellphones, namely the Redmi Note 13 Pro Plus, will be powered by the Dimensity 7200 Ultra SoC.

Also read: Specifications and Price of Redmi Note 12 Pro 4G in Indonesia

It was not stated when this cellphone would be launched. However, rumors claim that the Redmi Note 13 Pro Plus, which will reportedly be equipped with a 200 MP main camera, will launch sometime this month, as summarized by KompasTekno from Gizmochina, Thursday (14/9/2023).

Reportedly, the main camera of this cellphone will carry the “Discovery Edition” version of the Isocell HP3 sensor. This version is said to be more capable than the “regular” Isocell HP3, and is present on the Redmi Note 13 Pro Plus thanks to collaboration between Samsung and Xiaomi.

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2023-09-14 04:00:00
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