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MediaTek equips Dimensity 1200 and 1100 5G with AI and multimedia

Jakarta (ANTARA) – Global semicondutor company MediaTek has launched chipset smartphone The new Dimensity 1200 and Dimensity 1100 5G with AI, camera and multimedia features to support even more powerful 5G technology.

Addition chipset The 6nm Dimensity 1200 and 1100 to MediaTek’s 5G portfolio provide a range of options for toolmakers or devices to design smartphone 5G is highly capable with camera, graphics and enhanced connectivity features.

“MediaTek continues to expand its 5G portfolio with integrated solutions for a variety of devices from high to middle class,” said MediaTek’s Corporate Vice President and General Manager for the Wireless Communications business unit, JC Hsu, in a written statement, quoted Thursday.

“Dimensity 1200 is supported by a 200MP camera and more advanced AI capabilities, in addition to connectivity, display, audio and enhancements game innovative, “he continued.

The Dimensity 1200 and 1100 pack a 5G modem that is integrated with MediaTek’s 5G UltraSave technology for huge power savings.

Also read: MediaTek announces its 5G chip for mid-range mobile phones, Dimensity 720

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Second chipset it supports every generation of connectivity from 2G to 5G, in addition to supporting the latest connectivity features including 5G standalone and non-standalone architectures, 5G carrier aggregation (2CC) across frequency division duplex (FDD) dan time division duplex (TDD), dynamic spectrum sharing (DSS), True Dual SIM 5G (5G SA + 5G SA) dan Voice over New Radio (VoNR).

Chipset It also integrates the 5G HSR Mode and the 5G Elevator Mode enhancement to ensure a seamless and reliable 5G connection across the network.

For multimedia, the Dimensity 1200 supports 200MP for photography with a five-core HDR-ISP, making 4K HDR video recording for a much greater dynamic range.

Chipset it integrates the latest version of the processor AI hexa-core MediaTek (MediaTek APU 3.0), which has an enhanced multi-task scheduler that is claimed to reduce latency and improve power efficiency.

Meanwhile, the Dimensity 1100 packs a 108MP camera capability, and integrates with the APU 3.0 for power-efficient, high-performance computing.

Second chipset It supports AI camera features including AI-Panorama Night Shot, AI Multi-Person Bokeh, AI noise reduction (AINR) and HDR capabilities. The chipset also supports new AI-enhanced video playback features including AI SDR-to-HDR.

In terms of performance, the Dimensity 1200 has a CPU octa-core designed with Arm Cortex-A78 ultra-core up to 3GHz for extreme performance, three Arm Cortex-A78 super cores, and four Arm Cortex-A55 efficiency cores.

Meanwhile, Dimensity 1100 is designed with a CPU octa-core which includes four Arm Cortex-A78 cores operating at up to 2.6GHz and four Arm Cortex-A55 efficiency cores, along with the nine-core Arm Mali-G77 GPU.

Also read: MediaTek public tests its 5G IoT data connection with the Inmarsat satellite

Second chipset is manufactured using TSMC’s 6nm process technology.

Furthermore, for screen display, Dimensity 1200 supports speed refresh 168Hz, while the Dimensity 1100 supports speed refresh 144Hz.

Second chipset it supports technology game MediaTek’s HyperEngine 3.0, plus touch-screen responsiveness multi-touch boost.

Chipset the new also supports deep beam tracking game mobile and artificial reality applications (artificial reality) for more realistic visuals, along with hotspot power saving which allows users to spend longer time between charges.

Dimensity 1200 and 1100 support Bluetooth 5.2, which allows users to do so streaming to multiple wireless devices simultaneously.

This chipset also supports ultra low latency true wireless stereo audio and LC3 encoding for even higher quality, audio streaming low latency which is also very power efficient to extend battery life earbud wireless.

Dimensity 1200 has received TÜV Rheinland certification for its 5G performance, with real testing covering 72 scenarios.

A number of OEMs, including Xiaomi, Vivo, OPPO, and realme, have expressed support for chip New Dimensity from MediaTek.

The first device with chipset The new MediaTek Dimensity 1200 and 1100 are expected to hit the market in late Q1 and early Q2 of this year.

Apart from that, other industry collaborators also support MediaTek 5G chipsets including Arm, China Mobile, Tetras.AI, ArcSoft and Tencent Games.

Also read: MediaTek surpassed Qualcomm to become the largest mobile chipset vendor in Q3 2020

Also read: MediaTek announces new 5G chipset for “mainstream smartphones”

Also read: MediaTek extends its 5G platform with chipsets for routers

Reporter: Arindra Meodia
Editor: Maria Rosari Dwi Putri

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