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The Snapdragon 888 Plus insert is already being tested

It could be built into top-of-the-line mobiles arriving in the third quarter, and Honor is also said to use it.

Ever since Honor has been operating as a stand-alone company and has broken all ties with Huawei, it has been able to work with Qualcom again. It has already been confirmed by the manufacturer himself that they will be built on the company’s tiles, and it has been an open secret for some time that the Snapdragon 888 will be included in the Honor 50 Pro + top mobile phone.

Source: qualcomm

However, according to Digital Chat Station sources, Honor is already out there as well prepareto build a new mobile on Qualcomm’s updated top tile. Manufacturers are said to be testing the Snapdragon 888 chip and will be releasing their smartphones in the third quarter.

The Plus version will promise some extra performance over the regular version over the past few years. In the meantime, Honor will unveil its 50 series in May, and the Magic series will also be resurrected. The company says it will bring better handsets than the Huawei P and Mate series. However, it remains a big question when these will be available in Europe.

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