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China Seeks US Chip Export Relaxations for AI Trade Deal

by Priya Shah – Business Editor

China Seeks U.S. Chip Export Relief in Potential trade Deal


Beijing is requesting that the United States ease export controls on high-bandwidth memory (HBM) chips, a critical component for Artificial intelligence, as a condition for a potential trade agreement ahead of a possible summit between Presidents Donald Trump and Xi Jinping, according to a report by the Financial Times on Sunday.

Chinese officials have communicated this request to experts in Washington, specifically targeting restrictions on HBM chips. These chips are essential for accelerating data-intensive AI operations and are closely monitored by investors due to their integral role with AI graphics processors, notably those produced by Nvidia.

Requests for comment from the White House, the State Department, and ChinaS foreign ministry regarding the report were not immediately answered.

China’s concern stems from the belief that U.S. HBM controls are hindering the progress of AI chips by Chinese companies, including Huawei. The United States has implemented successive export controls on advanced chips to China, aiming to limit Beijing’s advancements in both Artificial Intelligence and defence technologies.

Despite the impact on U.S. firms’ ability to fully capitalize on the substantial demand from China-one of the world’s largest semiconductor markets-China remains a important revenue source for American chip manufacturers.

China Seeks US Chip Export Relaxations for AI Trade Deal

A SK Hynix Inc. 12-layer HBM3E memory chip displayed at the Semiconductor Exhibition in Seoul, South Korea. (Bloomberg | Bloomberg | Getty Images)

Background: The Rise of HBM and U.S.-China Chip Wars

High-Bandwidth Memory (HBM) represents a significant advancement in memory technology, designed to deliver substantially higher performance than conventional DRAM. It achieves this through a three-dimensional stacking of memory dies, connected via through-silicon vias (TSVs). This architecture allows for a much wider data bus and substantially faster data transfer rates, making HBM crucial for demanding applications like AI, high-performance computing, and advanced graphics.

The current landscape of HBM production is dominated by a few key players, including SK Hynix, Samsung, and Micron. The United States has been increasingly concerned about maintaining its technological edge in this area, particularly as China invests heavily in its domestic semiconductor industry.

The U.S.-China chip war began escalating in 2020 with restrictions on exports of technology to Chinese companies deemed a national security risk. These restrictions have broadened over time, encompassing more advanced chips and manufacturing equipment. The goal is to slow China’s technological progress and prevent the development of capabilities that could threaten U.S. interests. However,these measures have also created disruptions in the global supply chain and raised concerns about the impact on U.S. companies.

Past trends show a consistent increase in demand for HBM, driven by the rapid growth of AI and machine learning.This demand is expected to continue rising in the coming years, making HBM a strategically important technology.

Frequently Asked Questions

  • What is HBM? High-Bandwidth Memory is a high-performance RAM interface for 3D-stacked synchronous dynamic random-access memory (SDRAM).
  • why is HBM important for AI? HBM’s fast data transfer rates are essential for the computationally intensive tasks involved in Artificial Intelligence.
  • What are the U.S. export controls on chips to China? The U.S. has imposed restrictions on the export of advanced chips and chipmaking equipment to China, aiming to limit its technological advancement.
  • Who are the major HBM manufacturers? SK Hynix, Samsung, and Micron are the leading producers of HBM chips.

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