YMTC and CXMT Partner to Boost China’s HBM Capabilities
BEIJING – Yangtze Memory Technologies Corp (YMTC) and changxin Memory Technologies (CXMT) have formed a strategic partnership to accelerate the development and production of High Bandwidth Memory (HBM) in China, according to recent reports. The collaboration unites YMTC’s expertise in 3D NAND flash memory with CXMT’s DRAM capabilities, aiming to establish a fully domestic supply chain for this critical component used in artificial intelligence (AI) and high-performance computing (HPC) applications.
This alliance arrives as China intensifies efforts to achieve self-sufficiency in advanced semiconductor technology,notably in the face of escalating export controls from the United States. HBM production has become a key strategic area, with advanced packaging – including techniques like hybrid bonding – emerging as a critical bottleneck. The partnership seeks to overcome these challenges by combining the strengths of two leading Chinese memory manufacturers.The collaboration will focus on integrating DRAM and NAND flash using hybrid bonding technology, a complex process essential for creating high-density HBM stacks. CXMT has been actively developing HBM packaging methods alongside other Chinese firms like Wuhan Xinxin, while Tongfu Microelectronics is expanding into HBM assembly. This move is largely driven by the increasing difficulty of outsourcing semiconductor assembly and test as geopolitical tensions rise.
The U.S. government’s tightening of export controls, including the impending revocation of TSMC’s fast-track authorization to ship tools to its Nanjing plant by the end of 2025, further underscores the urgency for China to build independent capabilities. While the YMTC-CXMT partnership represents a significant step forward, the success of domestically produced HBM will ultimately depend on securing access to necessary tools and achieving customer qualification beyond the Chinese market.
