Home » Technology » Redmi mulls iPhone 17 Air rival in new leak

Redmi mulls iPhone 17 Air rival in new leak

Redmi Eyes Ultra-Slim Smartphone Race, Mimicking Rumored iPhone 17 Air

Xiaomi Sub-Brand Hints at Ultra-Thin Challenger Following Apple’s Whispered Innovation

A burgeoning trend towards ultra-slim smartphones, reportedly spearheaded by a rumored “iPhone 17 Air,” is capturing the attention of the tech world. Now, Xiaomi’s popular sub-brand, Redmi, appears poised to enter this competitive arena.

Industry Buzz Around Slim Design

The supposed “iPhone 17 Air” is increasingly cited as the catalyst for a new generation of svelte mobile devices. Latest whispers suggest the device could measure under 6 millimeters in thickness. This potential breakthrough has prompted a notable reaction from Redmi’s general manager, **Wang Teng Thomas**.

“The industry can learn a lot from its existence.”

Wang Teng Thomas, General Manager of Redmi

Wang Teng Thomas‘s enthusiastic endorsement on Weibo is being widely interpreted as a strong signal that Redmi may indeed be developing its own ultra-thin competitor. This move would follow Redmi’s successful launch of the K Pad, a device noted for its 6.5mm thickness, resembling an iPad Mini clone.

Engineering the Slim Factor

To achieve comparable thinness, Redmi might need to adopt advanced manufacturing techniques, potentially mirroring Apple’s rumored approach. This could involve a precision milling process that carves the mid-frame from both sides to reduce overall depth.

The challenge will be integrating substantial battery capacity within such a slender chassis. Redmi has demonstrated prowess in battery technology, utilizing silicon-carbon advancements in models like the Turbo 4 Pro and the Redmi 15 5G, both released in 2025.

For context, the Samsung Galaxy S25 Edge, noted for its ~5.8mm profile, is currently available for around $725 in renewed condition on Amazon (Amazon).

A recent “17 Air” render. (Image source: @MysteryLupin via X)

As the smartphone market continues to evolve, the pursuit of extreme thinness presents both engineering hurdles and exciting possibilities for innovative device design.

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