MediaTek To Introduce Dimensity 8200-Ultra Chipset with 5G and Better Imaging Technology for Xiaomi Civi 3

Jakarta (ANTARA) – Semiconductor company MediaTek will introduce the Dimensity 8200-Ultra chipset, which was first used on the Xiaomi Civi 3 cellphone, citing a Gizmochina report released Thursday (18/5) local time.

The Dimensity 8200-Ultra is built via TSMC’s 4nm manufacturing process. MediaTek offers four Cortex A78 cores and four Cortex A55 cores, which are claimed to produce powerful chipsets with an Antutu benchmark score of more than 900,000 points.

The Dimensity 8200-Ultra also includes a Mali-G610 MC6 GPU. The chipset supports 5G connectivity with speeds of up to 17 Gbps and supports Wi-Fi 6E and Bluetooth 5.3.

The collaboration between MediaTek and Xiaomi, through the Xiaomi Civi 3 cellphone powered by Dimensity 8200-Ultra, will focus on image processing or better image processing.

Dimensity’s open architecture enables seamless integration between the MediaTek platform and Xiaomi’s imaging capabilities. Meanwhile Xiaomi has provided a cross-platform intermediary layer that allows easy adaptation of Imaging Brain image processing to the Dimensity mobile platform.

The integration of Xiaomi’s Imaging Brain framework brings 38 imaging functions to the Dimensity mobile platform, which will provide more optimized speed and power consumption compared to previous devices, with a 235 percent increase in burst speed.

Also read: Mediatek presents Dimensity 9200+ for 5G smartphones

Also read: MediaTek is rapidly shifting focus to automotive and AI computing

Also read: Qualcomm is preparing to introduce the latest Snapdragon 7 chipset

Translator: Rizka Khaerunnisa
Editor: Natisha Andarningtyas
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