Gigabyte Unveils High-Density Multi-Node Blade Servers with Integrated Liquid Cooling
Gigabyte showcased innovative multi-node blade server designs at Computex 2025, signaling a notable expansion into high-density computing solutions.The new systems, demonstrated in a 6U chassis, pack up to 10 nodes and feature fully integrated liquid cooling, eliminating the need for external rack connections.This move positions Gigabyte to capitalize on the growing demand for compact, powerful servers, notably within the entry-level Intel Xeon and AMD EPYC markets and the rapidly evolving AI data center landscape. The integrated liquid cooling approach addresses the escalating power and cooling challenges associated with high-TDP processors, perhaps offering a more efficient and scalable alternative to conventional air-cooled systems. With 20x 500W TDP CPUs potentially reaching 10kW, these systems rival the density of current 8-GPU air-cooled AI servers.
The prototype nodes feature liquid cooling for both the CPU and memory, with rear nozzles connecting to an internal manifold. This design simplifies infrastructure by removing the requirement for external warm and cool liquid cooling connections to a rack manifold.
Gigabyte has additional versions of these multi-node systems under advancement, according to the company. As AI data centers increasingly adopt liquid cooling technologies-a trend expected to accelerate in 2026-blade servers with integrated liquid cooling are poised to become a more mainstream option.
