Resonac Leads Global Effort to Advance Chip Packaging for AI era
TOKYO - Resonac, a leading Japanese semiconductor materials manufacturer, has launched a collaborative consortium of nearly 30 companies worldwide to accelerate the development of next-generation chip packaging technologies. The initiative aims to address the growing need for more powerful and cost-effective computing solutions driven by the rapid expansion of artificial intelligence.
The consortium’s focus on advanced chip packaging – the process of integrating multiple chips into a single module – reflects a critical shift in the semiconductor industry. As customary chip scaling reaches its limits, packaging innovations are becoming increasingly vital for boosting performance and efficiency. This move comes as demand for AI-capable hardware surges, placing immense pressure on the industry to deliver greater computing power.
Resonac’s consortium will concentrate on developing technologies that go beyond conventional packaging methods, exploring techniques like chiplet integration and advanced interconnects. By pooling resources and expertise, the companies involved hope to overcome technical hurdles and accelerate the deployment of these crucial advancements. The collaboration signals a proactive response to the escalating demands of the AI revolution and the broader need for enhanced semiconductor capabilities.
