Samsung’s Exynos 2600 Promises Significant Cooling Advancement
Seoul, south korea – November 6, 2025 – Samsung has announced that its upcoming Exynos 2600 processor achieves up to 30% better thermal performance compared to the Exynos 2500, at the same performance level. The improvement stems from the integration of a heat transfer block (HPB) directly on top of the system on Chip (SoC).
Kim Dae-woo, Senior Vice President and Head of Samsung’s processor development team, confirmed the HPB implementation during a presentation at the ISMP 2025 event. The HPB allows for more efficient heat dissipation, reducing the Exynos 2600’s operating temperature.
According to Samsung, the 30% reduction in heat output, compared to the Exynos 2500, could allow for increased clock speeds and sustained performance. Preliminary benchmark tests indicate the Exynos 2600 is already demonstrating strong performance. In Geekbench 6 testing, the chip scored 3,400 points in single-core tests and 11,600 points in multi-core tests.
Recent reports also suggest the Exynos 2600 exhibits improved energy efficiency, with a reported 60% reduction in power consumption compared to Apple’s A19 Pro chip. The enhanced thermal and power characteristics have fueled speculation that samsung may utilize the Exynos 2600 in all models of the upcoming Galaxy S26 series, including the Galaxy S26 Ultra – a device that has exclusively featured Qualcomm’s flagship chips since the 2023 Galaxy S23 Ultra.
Samsung has historically varied chip suppliers and regional availability, employing both Snapdragon and Exynos processors in its Galaxy S series. The company’s final decision regarding the Galaxy S26’s processor configuration will not be officially revealed until March.
