Vertiv has launched three new Coolant Distribution Units (CDUs) for liquid cooling in high-performance computing (HPC) and artificial intelligence (AI) applications: the Vertiv CoolChip CDU 70,CDU 100,and CDU 600. These direct-to-chip (DTC) liquid thermal management systems are designed for both new data center builds and retrofitting existing ones, offering various configurations including in-rack and row-based options, and utilizing both liquid-to-air and liquid-to-liquid technologies.
the Vertiv CoolChip CDU 70 is an in-row, liquid-to-air unit designed for data centers that need to integrate with existing thermal infrastructure. It provides up to 70 kilowatts of cooling capacity and features an integrated controller for real-time monitoring,group control,and unit-to-unit interaction,enabling coordinated thermal performance and efficient scaling.
The Vertiv CoolChip CDU 100 is a liquid-to-liquid, in-rack cooling solution for high-density workloads. It delivers 100 kilowatts of cooling in a compact 4U form factor. Key features include a large-surface heat exchanger for low approach temperatures, an integrated controller for monitoring and control, and built-in fluid filtration to ensure fluid quality and thermal stability.
The Vertiv coolchip CDU 600 is an in-row, liquid-to-liquid model specifically for AI and HPC deployments, particularly in hyperscale and colocation environments. This 600-kilowatt system supports in-row configurations and can be integrated into raised-floor or retrofit installations. It offers flexible piping connections (top or bottom) and optional internal manifolds to simplify infrastructure planning. the CDU 600 also boasts redundant pumps and advanced monitoring for temperature and fluid quality to speed up installation and ensure reliable operation.
Liquid cooling, in general, uses liquids like water or specialized coolants to efficiently absorb and transfer heat from high-power electronic components.This method is more effective than traditional air cooling for managing dense heat loads in demanding applications such as HPC, data centers, and military electronics. Common liquid cooling techniques include direct-to-chip (DTC) cooling, cold plates, and immersion cooling.
For more details, visit Vertiv at www.vertiv.com.
