Apple will launch its first foldable iPhone alongside the iPhone 18 Pro and iPhone 18 Pro Max in September, according to industry analyst Jeff Pu. The new devices will be powered by the A20 Pro chip, built on TSMC’s 2nm process, offering performance improvements of up to 15 percent faster and 30 percent greater efficiency compared to A19 chips.
The A20 Pro chip will utilize TSMC’s Wafer-Level Multi-Chip Module (WMCM) technology, integrating RAM directly onto the same wafer as the CPU, GPU and Neural Engine. This packaging change is expected to accelerate performance for Apple Intelligence tasks and extend battery life, although also reducing the chip’s overall size to create more internal space within the iPhone, Pu noted in an investor note reported by MacRumors.
The new 2nm process, designated N2 by TSMC, incorporates super-high-performance metal-insulator-metal (SHPMIM) capacitors, more than doubling capacitance density and reducing sheet and via resistance by 50 percent. These improvements are designed to enhance power stability, boost performance, and improve energy efficiency.
Both the iPhone Fold and the iPhone 18 Pro models are expected to feature 12GB of LPD5 RAM and 48-megapixel rear cameras. The iPhone 18 Pro models are also anticipated to include a variable aperture system on their main cameras, allowing for greater control over light intake and depth of field.
A key design change for the iPhone 18 Pro and Pro Max is expected to be the placement of the TrueDepth camera system, which powers Face ID, under the display. This will allow for a smaller Dynamic Island, according to reports. The devices will also support Wi-Fi 7, Bluetooth 6, and Thread connectivity, alongside Apple’s C2 modem for mobile connectivity.
Apple is employing a split-launch strategy, with the standard iPhone 18 and a more affordable iPhone 18e not expected to debut until spring 2027. The company’s plans for a thinner-bodied “iPhone Air 2” remain unclear.
