AMD Confirms 2nm Fabrication for 2026 Zen 6 Processors, Details Zen 7 Roadmap
AMD has revealed its next-generation processor architectures, Zen 6 and Zen 7, outlining a path toward increased performance, efficiency, and artificial intelligence capabilities. The company confirmed Zen 6, slated for release in 2026, will be built on a cutting-edge 2nm fabrication process.This announcement, made during the Financial Analyst Day 2025 event, signals a important leap forward in AMD’s competitive positioning against Intel and other chip manufacturers.
Zen 6 will arrive in two distinct versions: a high-performance “standard” variant and a power-efficient “Zen 6C” core designed for low-power devices. Both will feature enhanced AI processing capabilities wiht support for new data formats and an expanded AI pipeline. These advancements are poised to impact a wide range of computing applications, from data centers and desktops to mobile devices, as AI integration becomes increasingly crucial.
AMD plans to deploy Zen 6 across its flagship product lines, including the EPYC Venice server processors, Ryzen Olympic Ridge desktop processors, and medusa Point mobile processors.The server-focused Helios rack, utilizing Zen 6, will incorporate 5th generation Infinity Fabric, 64 GB/s SerDes interconnects, and support for PCIe 7.0 and PAM4, enabling data transfer rates up to 224 GB/s.
Looking ahead, AMD provided a preliminary glimpse into Zen 7, expected around 2027 with the EPYC Verano processors. zen 7 will leverage a “future node” fabrication technology and introduce a new Matrix Engine alongside support for even more advanced AI data formats, building upon the foundations established with Zen 6.
