Raytron: New Thermal Imaging Modules Launched at MWC 2024

March 23, 2026 Rachel Kim – Technology Editor Technology

SHANGHAI, March 20, 2026 – Raytron Microelectronics, a subsidiary of Raytron Technology Co., Ltd., launched three new infrared thermal imaging modules – WN2T, DVS256, and ECOT – at MWC Barcelona 2026, signaling a broadening application of thermal sensing technology beyond traditional industrial uses.

The modules are designed for integration into a range of devices, from consumer electronics and smart home systems to industrial inspection equipment and commercial drones, according to a press release. Raytron’s marketing theme for the launch is “See Heat. Anywhere.”

The WN2T module, the latest iteration in the WN2 series, focuses on high-precision temperature measurement. It offers resolutions ranging from 256×192 to 640×512 and incorporates a 12 µm infrared detector alongside a second-generation infrared ISP, intended to provide stable and clear imaging. A key addition to the WN2T is a real-time temperature display function, presenting accurate temperature data directly on thermal images. Raytron suggests this capability will be valuable for predictive maintenance, solar panel inspection, and monitoring critical equipment.

The DVS256 module is targeted toward consumer electronics integration, combining infrared and visible light imaging to enhance visual clarity. Operating at 256×192 resolution and a 25 Hz frame rate, it is designed for low-power consumption and compatibility with both Android and iOS platforms. Raytron envisions the DVS256 being used in handheld thermal cameras and smartphone accessories.

For applications requiring a small form factor, Raytron introduced the ECOT series, a 160×120 LWIR module measuring 10.5 mm x 10.5 mm x 5 mm. The company highlights its suitability for space-constrained environments.

Raytron Microelectronics’ move to expand thermal imaging into consumer applications reflects a broader industry trend, according to industry observers. The company’s modules aim to make heat-sensing capabilities more accessible for everyday use, extending beyond specialized industrial and military applications.