HARIANHALUAN.COM – At a recent symposium, Taiwan Semiconductor Manufacturing Co. (TSMC) revealed its plans to release chipset 3 nanometers in size. The plan will be realized in 2023. This relates to the information that TSMC in the next few years will develop chipset with a smaller size.
Launching Gizmologi from Gizmochina on Friday (24/6), it is planned that there will be five chipset with 3 nanometer fabrication named N3E, N3P, N3S, and N3X. The N3 variant is claimed to offer a better process window, higher performance, increased transistor density and increased voltage for very high performance applications.
Embedded technology in chipset it will showcase proprietary FINFLEX architectural innovations TSMC which offers high flexibility to chip designers. In addition, these innovations allow them to precisely optimize chip performance, power consumption and cost. Reportedly the N3 was made and developed for the Apple brand which is claimed to take advantage of increased performance, power, and area (PPA).
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This plan will offer a tremendous improvement over the N3, with a 10-15 percent speed increase at the same power. The first N3 chips are expected to go into production in the next few months and will arrive on the market in the first quarter of 2023. The production of the 2 nanometer chip is slated to start in 2025.
This is the information that contains the news TSMC in preparation for production chipset with 3 nanometer fabrication.
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