Jakarta, CNN Indonesia –
Apple reportedly is testing steam room cooling technology. The technology is planned to be embedded in iPhone 13 which are expected to be released late 2021.
By Apple, this new technology was developed to keep the iPhone’s temperature awake when used to open many applications. According to Apple the technology is the company’s “key” in the future mobile market.
Apple analyst Ming-Chi Kuo says Apple is aggressively testing the feature, and there is still data to gather. It is rumored that the technology will almost certainly be used by Apple products, possibly this year.
Launch Tech RadarThe cooling system is basically a miniature version of the cooling system on rig gaming high class. The system works by evaporating water or a special liquid at a hot spot that comes from a major internal component. Then, the cold energy traps heat in the cell phone.
According to Kuo, Apple has been working on the technology for some time, even though it hasn’t been deemed to have a high enough standard to put into it smartphone.
Steam rooms on smartphones aren’t really new. Huawei is known to have included that technology in the Mate 20 X. Microsoft has also been exploring the concept as a potential option for keeping its mobile devices running cooler.
Quoting SlashdotKuo believes Apple is very likely to incorporate steam room technology into its upcoming iPhone models, although it’s unclear if the system will be ready this year.
In general, steam room technology (VC) involves the evaporation of a liquid (usually water) in a special pipe or heat-retaining structure that penetrates through the device.
“An important reason for the iPhone not to adopt the VC is because the reliability test results did not meet Apple’s high requirements. However, we are optimistic about the VC reliability upgrade schedule and hope that at least high-end iPhone models will be equipped with VC in the near future,” said Kuo.
Kuo also believes the iPhone will need a VC to keep up with the fast adoption of 5G and the ever-increasing CPU thermal load.
(mik / mik)
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